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China's leading manufacturer of PCB Laser Dapaneling Machine
One-Stop PCB Depaneling Solutions




1) Materials at a Glance Ceramics (Al₂O₃/AlN, HTCC/LTCC): Extremely hard, brittle, thermally conductive, low CTE. Mechanical tools induce cracks and…

UV laser depaneling delivers narrow kerf (≈20–50 µm), clean edges, and stress-free separation—raising panel yield and cutting rework versus routing,…

TL;DR 1) Kerf & Spacing Basics (the only math that matters) Boards-per-panel (BPP) formula (no nesting/rotations): UsableWidth = PanelWidth –…
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