




| Parameter | ZAM310S |
| Laser Type | Green or UV; picosecond or nanosecond options |
| Laser Wavelength | 355 nm / 532 nm |
| System Accuracy | ±25 µm |
| Repeatability | ±2 µm |
| Processing Head | Galvo scanner, Scanlab |
| Vision Alignment | CCD, 1.6 MP (standard) |
| Max Processing Area | 350 × 350 mm |
| Platform Height | 900 ± 50 mm |
| Machine Platform | Granite base, linear motors |
| Safety | Safety light curtain; automatic doors |
| Data Preparation Software | CircuitCAM 7 Standard |
| Machine Control Software | DreamCreaTor 3 |
| Machine Dimensions (H×W×D) | 1624 mm × 917 mm × 1207 mm |
| Machine Weight | 700 kg |
| Power Supply | 380 VAC / 50 Hz, 4.5 kW |




350 × 350 mm.
Cutting precision ±20 μm; repeat precision ±2 μm.
Offline single-platform (granite table).
FR-4, FPC/PI, LCP within process limits.
355 nm (UV) and 532 nm (Green).
Gerber, HPGL, Sieb & Meier, Excellon, ODB++.
CCD automatic target capture; supports irregular targets. If no fiducials exist, use DIL modules.
AC380V 50/60 Hz 2.5 kW (three-phase); compressed air 0.6 MPa, 50 L/min.
Windows 7/10; DreamCreaTor (control) and CircuitCAM 7 (data).

Micron-class repeatability for compact, high-accuracy work. Best when you need tight keep-outs and clean edges with minimal HAZ.

Two shuttle tables cut while you load the next panel—significant throughput gain vs. single-platform. Suited to standard SMT depaneling.

High-volume depaneling for large or multi-up panels. Faster cycle time from overlapping load/unload; optional inline upgrade pathway.

Drops straight into SMT lines; supports barcode/traceability and MES. Fits any PCBA outline; ideal when you want no manual load/unload.

High-stability X/Y split-axis for thick copper, rigid-flex, and complex outlines. Ships offline; can be upgraded to inline (three-section conveyor).