




Standard/HDI FR-4 with narrow kerf and ±20–25 µm cut accuracy; clean edges near copper pours and components.

Burr-free profile cuts and coverlay windows on PI/LCP stacks; tight radii, minimal HAZ, stable registration.

1) Materials at a Glance Ceramics (Al₂O₃/AlN, HTCC/LTCC): Extremely hard, brittle, thermally conductive, low CTE. Mechanical tools induce cracks and…

UV laser depaneling delivers narrow kerf (≈20–50 µm), clean edges, and stress-free separation—raising panel yield and cutting rework versus routing,…

TL;DR 1) Kerf & Spacing Basics (the only math that matters) Boards-per-panel (BPP) formula (no nesting/rotations): UsableWidth = PanelWidth –…