FR-4 estándar/HDI con corte estrecho y precisión de corte de ±20–25 µm; bordes limpios cerca de componentes y vertidos de cobre.
Cortes de perfil sin rebabas y ventanas de recubrimiento en pilas PI/LCP; radios ajustados, HAZ mínima, registro estable.
By eliminating the physical bending that cracks ceramic LED chips and MLCCs, you can boost your final yield by up to 5% and virtually eliminate field failures.
In a high-mix factory, the challenge is not only “how fast can we cut one panel?” The bigger question is: how can we run many board types, materials, batch sizes, and customer requirements without slowing down the whole production system?
By utilizing a non-contact UV laser process called "cold ablation," we guarantee zero mechanical stress on the board. This completely eliminates edge cracking, protects delicate internal vias, and allows you to safely place components within 0.1mm of the board edge.
Then, during the absolute final step of separating the panels, a mechanical router bit dulls, vibrates, and causes a microscopic fracture in a $500 medical PCBA.
