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China's leading manufacturer of PCB Laser Dapaneling Machine
One-Stop PCB Depaneling Solutions
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Building 2, Songhu Zhigu Research Center, Dongguan City, Guangdong Province, China
One-Stop PCB Laser Depaneling Solutions Manufacturer
PCBSEP builds high-precision systems to laser cut PCB panels with zero mechanical stress, clean edges, and fast throughput. From R&D to mass production, we deliver reliable and economy PCB laser depaneling and PCB singulation.
PCBSEP’s PCB Laser Depaneling Redefined
UV/Picosecond PCB Laser Depaneling for FR4, FPC & IMS
Stress-free PCB laser depaneling with micron-level kerf for FR4, rigid-flex/FPC, PTFE/RF, ceramics, IMS—offline or inline (SMEMA/MES). Fast, clean laser cut PCB. Optimize laser cutting PCB board by board size, material, and takt.
PCBSEP Since 2002
20+ years focused on PCB laser depaneling. Equipment in 2,000+ factories worldwide, serving Fortune 500 and SMEs. Two plants >26,000 m², 9 domestic service bases, sales/service in 28+ countries. ISO9001 / ISO14001 / ISO45001, CE, 100+ patents. On-site installation, operator training, and 24/7 remote support.
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Since 2002
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Exporting to EU & North America
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Hours of clinical wear trials
Industries & Use Cases
FR4-Materials
Standard/HDI FR-4 with narrow kerf and ±20–25 µm cut accuracy; clean edges near copper pours and components.
Flexible Circuit Boards
Burr-free profile cuts and coverlay windows on PI/LCP stacks; tight radii, minimal HAZ, stable registration.
PCB Laser Knowledge Base
Real-world recipes for FR-4, FPC, ceramics, and IMS.
How Inline Laser Depaneling Improves Throughput Without Adding Labor
A great machine helps you break terrible old habits. You can finally stop dumping baked boards onto a messy manual table. It hooks right up to your moving belts and it reads barcodes all by itself.
V-Groove PCB Depaneling for LED Manufacturing: Cut Costs and Boost Output
By eliminating the physical bending that cracks ceramic LED chips and MLCCs, you can boost your final yield by up to 5% and virtually eliminate field failures.
PCB Laser Depaneling Machine for High-Mix PCB Production Environments
In a high-mix factory, the challenge is not only “how fast can we cut one panel?” The bigger question is: how can we run many board types, materials, batch sizes, and customer requirements without slowing down the whole production system?
PCB Laser Depaneling Machine for HDI Boards: Eliminating Edge Cracks in Dense Designs
By utilizing a non-contact UV laser process called "cold ablation," we guarantee zero mechanical stress on the board. This completely eliminates edge cracking, protects delicate internal vias, and allows you to safely place components within 0.1mm of the board edge.
Frequently Asked Questions
Straight answers on capability, accuracy, and integration.
Which materials can you cut?
Typical accuracy & kerf?
Inline with MES?
Thermal impact on parts?
File formats?
Do you offer sample cutting?
Service scope?
Sample Cutting & Process Report
Send your CAD and panel details; we provide cut samples, photos, optional edge micrographs, recommended laser parameters, and a cycle-time/yield estimate so you can decide fast.
Remote Video Support
Live, encrypted video sessions for setup, recipe tuning, vision alignment, and basic maintenance. Quick scheduling, clear checklists, and follow-up notes to keep your line running.
On-Site Commissioning & Training
Certified engineers handle installation, calibration, and operator training—handing over SOPs and acceptance results to your quality standard. Available across our service regions.