One-Stop PCB Laser Depaneling Solutions Manufacturer
PCBSEP builds high-precision systems to laser cut PCB panels with zero mechanical stress, clean edges, and fast throughput. From R&D to mass production, we deliver reliable and economy PCB laser depaneling and PCB singulation.
PCBSEP’s PCB Laser Depaneling Redefined
UV/Picosecond PCB Laser Depaneling for FR4, FPC & IMS
Stress-free PCB laser depaneling with micron-level kerf for FR4, rigid-flex/FPC, PTFE/RF, ceramics, IMS—offline or inline (SMEMA/MES). Fast, clean laser cut PCB. Optimize laser cutting PCB board by board size, material, and takt.
PCBSEP Since 2002
20+ years focused on PCB laser depaneling. Equipment in 2,000+ factories worldwide, serving Fortune 500 and SMEs. Two plants >26,000 m², 9 domestic service bases, sales/service in 28+ countries. ISO9001 / ISO14001 / ISO45001, CE, 100+ patents. On-site installation, operator training, and 24/7 remote support.
0
Since 2002
0
Exporting to EU & North America
0
Hours of clinical wear trials
Industries & Use Cases
FR4-Materials
Standard/HDI FR-4 with narrow kerf and ±20–25 µm cut accuracy; clean edges near copper pours and components.
Flexible Circuit Boards
Burr-free profile cuts and coverlay windows on PI/LCP stacks; tight radii, minimal HAZ, stable registration.
PCB Laser Knowledge Base
Real-world recipes for FR-4, FPC, ceramics, and IMS.
[blocksy_posts limit=”4″ has_pagination=”no”]
Frequently Asked Questions
Straight answers on capability, accuracy, and integration.
Which materials can you cut?
Typical accuracy & kerf?
Inline with MES?
Thermal impact on parts?
File formats?
Do you offer sample cutting?
Service scope?