




Standard/HDI FR-4 with narrow kerf and ±20–25 µm cut accuracy; clean edges near copper pours and components.

Burr-free profile cuts and coverlay windows on PI/LCP stacks; tight radii, minimal HAZ, stable registration.

By eliminating the physical bending that cracks ceramic LED chips and MLCCs, you can boost your final yield by up to 5% and virtually eliminate field failures.

By utilizing a non-contact UV laser process called "cold ablation," we guarantee zero mechanical stress on the board. This completely eliminates edge cracking, protects delicate internal vias, and allows you to safely place components within 0.1mm of the board edge.

Then, during the absolute final step of separating the panels, a mechanical router bit dulls, vibrates, and causes a microscopic fracture in a $500 medical PCBA.

By standardizing your production lines with a pcb laser cutting machine, you instantly decouple your edge quality from the physical variables of PCB design. The benefits are massive and immediate.