

Typical ±20–25 µm cutting accuracy with ±2–3 µm repeatability (model-dependent).
Tens of microns; narrow kerf boosts panel utilization vs. routing or punching.
H1: 300×350 mm · S2: 350×350 mm · S4 (inline): 350×350 mm · H3 (inline, dual-platform): 300×300 mm · H3 330D (dual-platform): 350×520 mm · H5: 520×520 mm (up to 580×580 mm supported).
Comparable or faster on complex contours; no bit changes and fewer handling steps raise UPH.
FR-4/FR-5, FPC/PI, LCP, PTFE/RF, ceramics (Al₂O₃/AlN), IMS (Al/Cu core)—within process limits.
UV/Green (nanosecond/picosecond) processes keep HAZ minimal; no mechanical stress.
Yes—non-contact laser depaneling PCB is ideal for cutting close to components and copper.
Yes—barcode/QR, recipe control, and MES integration options on inline/automation-ready models.
Yes—automation modules are available; see each product page for compatibility.
Real-time extraction and filtration keep edges clean and the work area clear.
No tooling, no burrs, narrow kerf, and minimal handling reduce scrap and consumable spend.
Lens protection checks, extraction filters, and periodic vision/calibration routines.
Yes—send CAD and panels; we return cut photos/micrographs, parameters, and a cycle-time estimate.
Yes—on-site commissioning & operator training, plus remote video support.
Two plants (>26,000 m²), 9 domestic service bases, coverage in 28+ countries; 24/7 remote support and fast spares available.
H1 (compact precision) · S2 (offline daily SMT, 350×350) · S4 (track-inline) · H3 (inline dual-table) · H3 330D (dual-table 350×520; inline upgrade option) · H5 (large platform 520×520 / 580×580 max).