




معيار/HDI FR-4 مع شق ضيق ودقة قطع ±20–25 ميكرومتر؛ حواف نظيفة بالقرب من مصبوبات النحاس والمكونات.

قطع ملفات تعريف خالية من النتوءات ونوافذ التغطية على أكوام PI/LCP؛ نصف قطر ضيق، منطقة تأثير مضر ضئيلة، تسجيل مستقر.

By utilizing a non-contact UV laser process called "cold ablation," we guarantee zero mechanical stress on the board. This completely eliminates edge cracking, protects delicate internal vias, and allows you to safely place components within 0.1mm of the board edge.

Then, during the absolute final step of separating the panels, a mechanical router bit dulls, vibrates, and causes a microscopic fracture in a $500 medical PCBA.

By standardizing your production lines with a pcb laser cutting machine, you instantly decouple your edge quality from the physical variables of PCB design. The benefits are massive and immediate.

The benefits are massive and immediate: zero upfront tooling costs, zero mechanical stress transferred to delicate surface-mount components, and the unparalleled flexibility to jump from cutting rigid automotive FR4 boards to delicate medical polyimide flex circuits within the same afternoon.