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China's leading manufacturer of PCB Laser Dapaneling Machine
One-Stop PCB Depaneling Solutions
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Building 2, Songhu Zhigu Research Center, Dongguan City, Guangdong Province, China
Ceramic PCB Depaneling & Cutting
Laser cutting of ceramic circuit boards (PCBs) is a highly precise and efficient method for shaping and separating these rigid and brittle materials. Because of their exceptional hardness, ceramics are difficult to machine with traditional mechanical methods like milling or sawing, which can cause micro-cracking and component damage. ⚙️ Laser cutting provides a non-contact, stress-free alternative that is ideal for the demands of modern electronics.
Ceramic PCBs — Key Characteristics
Ceramics offer high thermal conductivity, low CTE, and chemical/mechanical robustness—perfect for harsh environments and thermal loads where FR-4 struggles.
Their extreme hardness makes mechanical cutting difficult; laser’s non-contact ablation is the practical alternative.
Their extreme hardness makes mechanical cutting difficult; laser’s non-contact ablation is the practical alternative.
Typical Applications
High-performance assemblies needing thermal stability and reliability.
Automotive: radar/sensor modules, ESC/ABS, EMS power boards
Medical: MEMS and diagnostics modules
Telecom/RF: front-ends, filters, power amplifiers
Aerospace/Defense: shock-resistant control and sensor circuits
Automotive: radar/sensor modules, ESC/ABS, EMS power boards
Medical: MEMS and diagnostics modules
Telecom/RF: front-ends, filters, power amplifiers
Aerospace/Defense: shock-resistant control and sensor circuits
Related Products
DirectLaser H1 — High-Precision, 300 × 350 mm
Micron-class repeatability for compact, high-accuracy work. Best when you need tight keep-outs and clean edges with minimal HAZ.
DirectLaser S2 — Offline, Single-Platform
Entry-level UV depaneler for low/medium takt SMT. Compact footprint, stable steel frame, cost-effective for standard FR-4/FPC jobs.
DirectLaser H3 — Dual-Platform, Offline
Two shuttle tables cut while you load the next panel—significant throughput gain vs. single-platform. Suited to standard SMT depaneling.
DirectLaser H3 330D — Dual-Platform, 350 × 520 mm
High-volume depaneling for large or multi-up panels. Faster cycle time from overlapping load/unload; optional inline upgrade pathway.
DirectLaser S4 — Inline PCBA Laser Depaneling
Drops straight into SMT lines; supports barcode/traceability and MES. Fits any PCBA outline; ideal when you want no manual load/unload.
DirectLaser H5 — Large-Platform, Bridge-Gantry
High-stability X/Y split-axis for thick copper, rigid-flex, and complex outlines. Ships offline; can be upgraded to inline (three-section conveyor).
Contact / Request a Sample
Send your ceramic stack-up and panel data for a fast recipe or sample-cut plan.
Sample Cutting & Process Report
Send your CAD and panel details; we provide cut samples, photos, optional edge micrographs, recommended laser parameters, and a cycle-time/yield estimate so you can decide fast.
Remote Video Support
Live, encrypted video sessions for setup, recipe tuning, vision alignment, and basic maintenance. Quick scheduling, clear checklists, and follow-up notes to keep your line running.
On-Site Commissioning & Training
Certified engineers handle installation, calibration, and operator training—handing over SOPs and acceptance results to your quality standard. Available across our service regions.