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China's leading manufacturer of PCB Laser Dapaneling Machine
One-Stop PCB Depaneling Solutions
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Building 2, Songhu Zhigu Research Center, Dongguan City, Guangdong Province, China
DirectLaser H1 — High-Precision UVPs PCB Laser Cutter
DirectLaser H1 is a high-precision, high-speed, clean-processing PCB laser depaneling system for modern electronics manufacturing.
It combines ±2 µm repeatability, ±25 µm cutting precision, and 1 µm X/Y resolution with automation-ready hardware, Class-1 safety, and intuitive software (DreamCreaTor 3 + Circuit CAM 7.5).
It combines ±2 µm repeatability, ±25 µm cutting precision, and 1 µm X/Y resolution with automation-ready hardware, Class-1 safety, and intuitive software (DreamCreaTor 3 + Circuit CAM 7.5).
Working area: 350 × 350 mm
Materials: FR-4, FPC/rigid-flex, PTFE/RF, ceramics, IMS ≤ 2.0 mm
Materials: FR-4, FPC/rigid-flex, PTFE/RF, ceramics, IMS ≤ 2.0 mm
DirectLaser H1 Redefining PCB Laser Depaneling
The single-platform H1 is ideal for cutting rigid, flex, and rigid-flex PCBs with tight keep-outs. Laser paths are software-controlled for fast changeovers and narrow kerf to improve panel utilization. Operators benefit from a streamlined UI and stable mechanics for repeatable, burr-free, low-HAZ edges.
Process advantages with laser
Software-defined paths
Change materials or contours by updating parameters—no mechanical tooling.
Stress-free & low-HAZ
Non-contact laser cutting avoids mechanical stress; heat is strictly controlled for clean edges.
Narrow kerf = more yield
Micro-kerf channels enable denser panelization and higher board-per-panel counts.
Software-defined paths
Change materials or contours by updating parameters—no mechanical tooling.
Stress-free & low-HAZ
Non-contact laser cutting avoids mechanical stress; heat is strictly controlled for clean edges.
Narrow kerf = more yield
Micro-kerf channels enable denser panelization and higher board-per-panel counts.
Process advantages with laserImport Gerber/ODB++/DXF/Excellon and go from data to cut in minutes.
Vision-guided accuracy
130 MP axial-parallel CCD with fiducial alignment ensures precise registration.
User-friendly HMI
Clear recipes, job queues, and assisted setup reduce training time.
Inline-ready interfaces
Compatible with loaders/unloaders, tray stackers, and SMEMA-style line integration.
Traceability options
Barcode/QR, recipe control, data logging for MES/ERP connectivity.
Safety-first design
Full enclosure, interlocks, and monitored extraction for Class-1 laser safety.
Vision-guided accuracy
130 MP axial-parallel CCD with fiducial alignment ensures precise registration.
User-friendly HMI
Clear recipes, job queues, and assisted setup reduce training time.
Inline-ready interfaces
Compatible with loaders/unloaders, tray stackers, and SMEMA-style line integration.
Traceability options
Barcode/QR, recipe control, data logging for MES/ERP connectivity.
Safety-first design
Full enclosure, interlocks, and monitored extraction for Class-1 laser safety.
DirectLaser H1 DataTable
| Item | DirectLaser H1 |
| Platform Type | Single Platform |
| Processing Area | 350 × 350 mm |
| Repeatability | ±2 μm |
| Overall Precision | ±25 μm |
| X/Y Resolution | 1 μm |
| Material Thickness | ≤ 2.0 mm |
| Platform Structure | Steel Structure |
| Motor Type | Servo Motor |
| Laser Type | Nanosecond |
| Laser Power | 15 W |
| Telecentric Lens Range | 50 × 50 mm, f = 100 mm；Domestic Galvanometer |
| CCD System | Axial-parallel |
| Positioning Accuracy | 0.01 mm |
| Camera Resolution | 130 MP |
| Control Software | DreamCreaTor 3 |
| Data Processing Software | Circuit CAM 7.5 Standard |
| File Formats | LMD, Standard Gerber (RS-274-D), Extended Gerber (RS-274-X), DXF, Excellon, Sieb & Meier, HP-GL, Barco DPF, ODB++ |
| Operating Environment | 22 °C ±2 °C |
| Power Supply | 380 VAC / 50 Hz / 2 kW |
| Weight | Approx. 580 kg |
| Dimensions (L×W×H) | 930 × 1270 × 1600 mm |
DirectLaser H1 PCB Laser Depaneling Image Gallery
Applicable materials: PCBA, FPC, LCP, MPI, PI, FR-4/polyimide, HTCC/LTCC ceramics, and other encapsulation materials.
PCBA Depaneling
Stress-free separation of assembled boards with dust-free edges. Cuts close to components and copper without mechanical load, improving yield. (Laser depaneling PCB / laser cut PCB board)
Gold-Finger Cutting
Fine trimming and singulation around connector “gold-finger” areas on FPC/PCB. Protects plating quality with tight tolerances and low heat input. (Gold-finger laser cutting)
FPC Profile Cutting
Clean, burr-free outlines on flexible circuits. Narrow kerf and minimal HAZ for tight radii and complex shapes—ideal for rigid-flex tails. (FPC laser cutting / PCB laser cutting)
Coverlay Cutting
Precise window openings and perimeter trimming on FPC coverlay. Consistent edges with no delamination, supporting PI/LCP stacks. (Coverlay laser cutting for rigid-flex/FPC)
Laser Source (Nanosecond UV — Power Options Available)DirectLaser H1 equips a 355 nm nanosecond UV laser optimized for PCB/FPC depaneling. High beam quality and stable output deliver clean, low-HAZ edges.
| Specification | 15 W UV Laser |
| Wavelength | 355nm |
| Max. Average Power | >15W@50KHz |
| Max.Pulse Energy | >300μJ |
| Repetition Rate | 40~300KHz |
| Pulse Width | <15ns |
| Beam Circularity | >90% |
| Diameter at window | ≈0.55mm |
| Beam Quality (M²) | <1.2 |
| Beam Divergence | <2mrad |
| Energy Stability | <3% RMS |
| Point Stability | <20μrad / ºC |
Frequently Asked Questions
Quick technical answers about process, quality, and integration.
What materials can H1 cut?
Does laser heat affect components?
What accuracy can I expect?
What is the maximum board size and thickness?
Which file formats are supported?
How does vision alignment work?
Can H1 run inline?
What utilities and environment are required?
Do you offer sample cutting?
Contact PCBSEP
Send your panel data—get a fast recommendation or sample-cut plan. Email: [email protected]. We review your data, propose the cut recipe and cycle-time estimate, and (if requested) arrange a sample cut.
Related Products
DirectLaser S2 — Offline, Single-Platform
Entry-level UV depaneler for low/medium takt SMT. Compact footprint, stable steel frame, cost-effective for standard FR-4/FPC jobs.
DirectLaser H3 — Dual-Platform, Offline
Two shuttle tables cut while you load the next panel—significant throughput gain vs. single-platform. Suited to standard SMT depaneling.
DirectLaser H3 330D — Dual-Platform, 350 × 520 mm
High-volume depaneling for large or multi-up panels. Faster cycle time from overlapping load/unload; optional inline upgrade pathway.
DirectLaser S4 — Inline PCBA Laser Depaneling
Drops straight into SMT lines; supports barcode/traceability and MES. Fits any PCBA outline; ideal when you want no manual load/unload.
DirectLaser H5 — Large-Platform, Bridge-Gantry
High-stability X/Y split-axis for thick copper, rigid-flex, and complex outlines. Ships offline; can be upgraded to inline (three-section conveyor).
Sample Cutting & Process Report
Send your CAD and panel details; we provide cut samples, photos, optional edge micrographs, recommended laser parameters, and a cycle-time/yield estimate so you can decide fast.
Remote Video Support
Live, encrypted video sessions for setup, recipe tuning, vision alignment, and basic maintenance. Quick scheduling, clear checklists, and follow-up notes to keep your line running.
On-Site Commissioning & Training
Certified engineers handle installation, calibration, and operator training—handing over SOPs and acceptance results to your quality standard. Available across our service regions.