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China's leading manufacturer of PCB Laser Dapaneling Machine
One-Stop PCB Depaneling Solutions
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Building 2, Songhu Zhigu Research Center, Dongguan City, Guangdong Province, China
DirectLaser S4 — Inline PCBA Laser Depaneler
Track-inline UV/Green laser depaneling system with a compact frame and 3-step conveyor. Drops into SMT lines quickly and supports any PCBA outline with clean, stress-free edges.
Working area: 350 × 350 mm
Table/Platform: Granite single table, inline track (3-step transfer)
Accuracy: ±20 μm cutting, ±3 μm repeat
Typical materials: FR-4, FPC/PI, LCP; assembled PCBA depaneling
Table/Platform: Granite single table, inline track (3-step transfer)
Accuracy: ±20 μm cutting, ±3 μm repeat
Typical materials: FR-4, FPC/PI, LCP; assembled PCBA depaneling
UV Laser System for Cutting and Drilling Flexible PCBs
S4 uses a 3-step inline feeding system and a fully enclosed cutting area. Interchangeable tooling enables fast product changeovers. The standardized interface and MES connectivity make digital integration straightforward.
What DirectLaser S4 DeliversInline throughput, simple operation, and reliable quality for daily SMT production.
Fast changeovers — interchangeable tools for quick switching between products.
3-step track feeding — simplified inline transfer for smooth, stable handling.
Intuitive operation — short learning curve for operators.
Standardized & safe — unified interfaces; enclosed working area for Class-1 level safety.
MES integration — barcode and data connectivity for traceable production.
Granite stability — rigid base supports repeatable precision in continuous runs.
Fast changeovers — interchangeable tools for quick switching between products.
3-step track feeding — simplified inline transfer for smooth, stable handling.
Intuitive operation — short learning curve for operators.
Standardized & safe — unified interfaces; enclosed working area for Class-1 level safety.
MES integration — barcode and data connectivity for traceable production.
Granite stability — rigid base supports repeatable precision in continuous runs.
DirectLaser S4 DataTable
| Model | DirectLaser-S4 |
| Valid cutting size | 350 x 350 mm |
| Cutting functions | Straight line; L-shape; U-shape; circle; arc |
| Process table | Single |
| Repeat precision | ±3μm |
| Cutting precision | ±20μm |
| Ambient temperature | 22℃±2℃(71.6℉±2℉) |
| Laser wavelength | 355 nm / 532 nm |
| Platform | Granite table |
| Automatic feeding | 3-step track transfer |
| Supported data formats | Gerber; HPGL; Sieb & Meier; Excellon; ODB++ |
| Operating system | Windows 7 / Windows 10 |
| Target reading | CCD automatic target capture; irregular target shapes; 'no target' requires DIL module |
| Cutting software | DreamCreaTor |
| Data processing software | CircuitCAM 7 |
| XYZ-axis drive | Linear + servo motors |
| Power | AC 380 V, 50/60 Hz, 2.5 kW, three-phase |
| Pneumatics | 0.6 MPa, 50 L/min |
| Dimensions (W x D x H) | 940 mm x 1,720 mm x 1,650 mm |
| Weight | 1,500 kg |
DirectLaser S4 — Frequently Asked Questions
Straight answers for capability, integration, and daily use.
Is S4 inline?
What is the working area?
How accurate is it?
Which materials are supported?
Which wavelengths/power options are available?
Is the system safe for operators?
How do I integrate with MES?
Contact PCBSEP
Email your panel data or a photo: material & thickness, board size, panel layout, target takt, and CAD files (Gerber/ODB++/DXF/Excellon). We’ll reply with the recommended S4 setup and a sample-cut plan.
Related Products
DirectLaser H1 — High-Precision, 300 × 350 mm
Micron-class repeatability for compact, high-accuracy work. Best when you need tight keep-outs and clean edges with minimal HAZ.
DirectLaser S2 — Offline, Single-Platform
Entry-level UV depaneler for low/medium takt SMT. Compact footprint, stable steel frame, cost-effective for standard FR-4/FPC jobs.
DirectLaser H3 — Dual-Platform, Offline
Two shuttle tables cut while you load the next panel—significant throughput gain vs. single-platform. Suited to standard SMT depaneling.
DirectLaser H3 330D — Dual-Platform, 350 × 520 mm
High-volume depaneling for large or multi-up panels. Faster cycle time from overlapping load/unload; optional inline upgrade pathway.
DirectLaser H5 — Large-Platform, Bridge-Gantry
High-stability X/Y split-axis for thick copper, rigid-flex, and complex outlines. Ships offline; can be upgraded to inline (three-section conveyor).
Sample Cutting & Process Report
Send your CAD and panel details; we provide cut samples, photos, optional edge micrographs, recommended laser parameters, and a cycle-time/yield estimate so you can decide fast.
Remote Video Support
Live, encrypted video sessions for setup, recipe tuning, vision alignment, and basic maintenance. Quick scheduling, clear checklists, and follow-up notes to keep your line running.
On-Site Commissioning & Training
Certified engineers handle installation, calibration, and operator training—handing over SOPs and acceptance results to your quality standard. Available across our service regions.