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China's leading manufacturer of PCB Laser Dapaneling Machine
One-Stop PCB Depaneling Solutions
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Building 2, Songhu Zhigu Research Center, Dongguan City, Guangdong Province, China
FR-4 Laser Cutting & Depaneling
Clean, stress-free laser depaneling for standard and HDI FR-4. Narrow kerf, stable ±20–25 µm cutting accuracy, and consistent edges—even close to copper pours and components.
What is FR-4?
FR-4 is a glass-fiber/epoxy PCB laminate (UL94 V-0 class). Formulations vary by supplier and stack-up, so water uptake, Tg, and dielectric properties differ.
Our process recipes are tuned per FR-4 variant to balance speed, HAZ, and edge quality.
Our process recipes are tuned per FR-4 variant to balance speed, HAZ, and edge quality.
Applications of FR-4
Everyday to high-reliability electronics.
Automotive: ECUs, lighting, sensor boards, IMS hybrids.
Consumer: Phones, wearables, accessories, HDI panels.
Medical: Diagnostics, handheld instruments, sensor modules.
Industrial/Power: Control boards, BMS, inverters, large multi-up arrays.
Automotive: ECUs, lighting, sensor boards, IMS hybrids.
Consumer: Phones, wearables, accessories, HDI panels.
Medical: Diagnostics, handheld instruments, sensor modules.
Industrial/Power: Control boards, BMS, inverters, large multi-up arrays.
Cutting FR-4 with a Laser
Why PCBSEP’s UV/Green process outperforms mechanical methods?
No mechanical stress or vibration—ideal for post-placement depaneling.
Narrow kerf (tens of µm) to improve panel utilization.
Low HAZ via multi-pass, low-fluence strategies; clean edges with fume extraction.
Free-form contours—slots, windows, tight radii without tooling.
No mechanical stress or vibration—ideal for post-placement depaneling.
Narrow kerf (tens of µm) to improve panel utilization.
Low HAZ via multi-pass, low-fluence strategies; clean edges with fume extraction.
Free-form contours—slots, windows, tight radii without tooling.
Related Products
DirectLaser H1 — High-Precision, 300 × 350 mm
Micron-class repeatability for compact, high-accuracy work. Best when you need tight keep-outs and clean edges with minimal HAZ.
DirectLaser S2 — Offline, Single-Platform
Entry-level UV depaneler for low/medium takt SMT. Compact footprint, stable steel frame, cost-effective for standard FR-4/FPC jobs.
DirectLaser H3 — Dual-Platform, Offline
Two shuttle tables cut while you load the next panel—significant throughput gain vs. single-platform. Suited to standard SMT depaneling.
DirectLaser H3 330D — Dual-Platform, 350 × 520 mm
High-volume depaneling for large or multi-up panels. Faster cycle time from overlapping load/unload; optional inline upgrade pathway.
DirectLaser S4 — Inline PCBA Laser Depaneling
Drops straight into SMT lines; supports barcode/traceability and MES. Fits any PCBA outline; ideal when you want no manual load/unload.
DirectLaser H5 — Large-Platform, Bridge-Gantry
High-stability X/Y split-axis for thick copper, rigid-flex, and complex outlines. Ships offline; can be upgraded to inline (three-section conveyor).
Contact / Request a Sample
Send your panel info for a fast recipe or sample-cut plan.. Include: material & thickness, board/panel size and array, copper keep-out near cut, cleanliness/HAZ limits, target takt, offline/inline + MES needs, and CAD (Gerber/ODB++/DXF/Excellon).
Sample Cutting & Process Report
Send your CAD and panel details; we provide cut samples, photos, optional edge micrographs, recommended laser parameters, and a cycle-time/yield estimate so you can decide fast.
Remote Video Support
Live, encrypted video sessions for setup, recipe tuning, vision alignment, and basic maintenance. Quick scheduling, clear checklists, and follow-up notes to keep your line running.
On-Site Commissioning & Training
Certified engineers handle installation, calibration, and operator training—handing over SOPs and acceptance results to your quality standard. Available across our service regions.