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China's leading manufacturer of PCB Laser Dapaneling Machine
One-Stop PCB Depaneling Solutions
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Building 2, Songhu Zhigu Research Center, Dongguan City, Guangdong Province, China
IMS — Laser Depaneling & Cutting
IMS, or Insulated Metal Substrates, are a type of printed circuit board (PCB) with a metal core, typically made of aluminum, copper, or stainless steel. They are used in applications that require high thermal conductivity and efficient heat dissipation, such as power electronics, automotive lighting, and consumer electronics.
What Are IMS Boards?
IMS (metal-core) PCBs combine a copper circuit layer, a dielectric layer, and a heat-spreading metal core (typically aluminum, copper, or stainless).
Layer thicknesses and thermal conductivities vary by design and drive application choice.
Layer thicknesses and thermal conductivities vary by design and drive application choice.
Cutting IMS with a Laser
Non-contact laser depaneling is a practical alternative to milling/routing on metal-core boards.
It avoids mechanical stress and eliminates metal swarf that can cause shorts; effective cutting speed depends on target edge quality and total thickness.
It avoids mechanical stress and eliminates metal swarf that can cause shorts; effective cutting speed depends on target edge quality and total thickness.
Related Products
DirectLaser H1 — High-Precision, 300 × 350 mm
Micron-class repeatability for compact, high-accuracy work. Best when you need tight keep-outs and clean edges with minimal HAZ.
DirectLaser S2 — Offline, Single-Platform
Entry-level UV depaneler for low/medium takt SMT. Compact footprint, stable steel frame, cost-effective for standard FR-4/FPC jobs.
DirectLaser H3 — Dual-Platform, Offline
Two shuttle tables cut while you load the next panel—significant throughput gain vs. single-platform. Suited to standard SMT depaneling.
DirectLaser H3 330D — Dual-Platform, 350 × 520 mm
High-volume depaneling for large or multi-up panels. Faster cycle time from overlapping load/unload; optional inline upgrade pathway.
DirectLaser S4 — Inline PCBA Laser Depaneling
Drops straight into SMT lines; supports barcode/traceability and MES. Fits any PCBA outline; ideal when you want no manual load/unload.
DirectLaser H5 — Large-Platform, Bridge-Gantry
High-stability X/Y split-axis for thick copper, rigid-flex, and complex outlines. Ships offline; can be upgraded to inline (three-section conveyor).
Contact / Request a Sample
Send your IMS stack-up and panel data for a fast recipe or sample-cut plan.
Sample Cutting & Process Report
Send your CAD and panel details; we provide cut samples, photos, optional edge micrographs, recommended laser parameters, and a cycle-time/yield estimate so you can decide fast.
Remote Video Support
Live, encrypted video sessions for setup, recipe tuning, vision alignment, and basic maintenance. Quick scheduling, clear checklists, and follow-up notes to keep your line running.
On-Site Commissioning & Training
Certified engineers handle installation, calibration, and operator training—handing over SOPs and acceptance results to your quality standard. Available across our service regions.