



1) Materials at a Glance Ceramics (Al₂O₃/AlN, HTCC/LTCC): Extremely hard, brittle, thermally conductive, low CTE. Mechanical tools induce cracks and particles; laser ablation is wear-free.IMS (Insulated Metal Substrates): Copper circuit + dielectric + Al/Cu (sometimes stainless) core. Great for thermal…

UV laser depaneling delivers narrow kerf (≈20–50 µm), clean edges, and stress-free separation—raising panel yield and cutting rework versus routing, punching, or milling. Why UV for PCB Singulation Kerf & Yield: The Math That Pays Edge Quality & HAZ Control…

TL;DR 1) Kerf & Spacing Basics (the only math that matters) Boards-per-panel (BPP) formula (no nesting/rotations): UsableWidth = PanelWidth – 2 * RailXUsableHeight = PanelHeight – 2 * RailY Across = floor( UsableWidth / (BoardX + SpacingX) )Down = floor(…