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China's leading manufacturer of PCB Laser Dapaneling Machine
One-Stop PCB Depaneling Solutions
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Building 2, Songhu Zhigu Research Center, Dongguan City, Guangdong Province, China
DirectLaser H3 330D — Dual-Platform Laser Depaneling Machine
Dual-platform laser depaneling system with a large 350 × 520 mm working area for high-throughput SMT jobs. Continuous processing reduces load/unload idle time and boosts takt.
Working area: 350 × 520 mm
Tables: Two (dual-platform) for continuous cutting
Accuracy: ±20 μm cutting, ±2 μm repeat
Platform: Marble/granite table
Wavelengths: 355 nm (UV) / 532 nm (Green)
Typical materials: FR-4, FPC/PI, LCP (and standard SMT stacks)
Tables: Two (dual-platform) for continuous cutting
Accuracy: ±20 μm cutting, ±2 μm repeat
Platform: Marble/granite table
Wavelengths: 355 nm (UV) / 532 nm (Green)
Typical materials: FR-4, FPC/PI, LCP (and standard SMT stacks)
Dual-table speed. Large area. Clean cuts.
Built for SMT depaneling, the H3 330D keeps the laser continuously in process while operators load the next panel. The large field handles multi-up or oversized panels with stable accuracy.
Features
Dual-table continuous processing — reduces load/unload time; laser stays in cutting state.
Large processing area 350 × 520 mm — fits wide PCB formats and multi-up panels.
SMT-ready workflows — ideal for depaneling pre-placed PCBs and coverlay window opening.
Camera target pre-positioning (optional) — camera-based alignment cuts positioning time.
Direct data-driven — import data and start; fast product introduction.
High automation — optional mechanical transfer arm (with scrap-board throw).
Options — UV 15/20/25 W or Green 35/60 W, laser height sensor, barcode reader & MES integration, laser power monitoring (camera-based), upgrade to inline.
Dual-table continuous processing — reduces load/unload time; laser stays in cutting state.
Large processing area 350 × 520 mm — fits wide PCB formats and multi-up panels.
SMT-ready workflows — ideal for depaneling pre-placed PCBs and coverlay window opening.
Camera target pre-positioning (optional) — camera-based alignment cuts positioning time.
Direct data-driven — import data and start; fast product introduction.
High automation — optional mechanical transfer arm (with scrap-board throw).
Options — UV 15/20/25 W or Green 35/60 W, laser height sensor, barcode reader & MES integration, laser power monitoring (camera-based), upgrade to inline.
DirectLaser H3 330D DataTable
| Model | DirectLaser H3 330D |
| Vaild cutting size | 350mm×520mm |
| Cutting function | Tweening to staight line,L shape,U shape,Circle,Arc |
| Process table | Two |
| Repeat precision | ±2μm |
| Cutting precision | ±20μm |
| Ambient Temperatur | 22℃±2℃(71.6℉±2℉) |
| Platform | Marble table |
| Transfer model（option） | Mechanical transfer arm（scrap board throwing） |
| Laser wavelength | 355nm/532nm |
| Receive Data Forma | Gerber, HPGL, Sieb & Meier, Excellon, ODB++ |
| Operation system | Windows 7 / Windows 10 |
| Target reads | CCD automatic target capture Target shape is irregular, no Target, DIL is required Modules |
| Cutting software | DreamCreaTor |
| Data processing software | CircuitCAM 7 |
| XYZ-axis driving mode | linear +servo motor |
| Voltage/Power requirement | AC380V 50/60Hz 2.5KW three phase |
| Pneumatic pressure requirement | 0.6MPa，50L/min |
| Dimensions(W*D*H) | 1600mm x2100mm x1600mm |
| Weight | 2000KG |
DirectLaser H3 330D Dual-platform Laser Depaneling Application Results
Applicable materials: PCBA Depaneling After Placement, Coverlay Window Cutting, FPC/Rigid-Flex Profile Cutting, Large Panel / Multi-Up Depaneling
MPI-PCB
Copper-PCB
Flexible-circuit-boards-for-polyimide
FR4-PCB
Frequently Asked Questions
Quick technical answers about process, quality, and integration.
What is the max working area?
How accurate is it?
Is S2 inline or offline?
Which wavelengths are available?
Which materials are supported?
Does it support MES/traceability?
How does vision alignment work?
What file formats are accepted?
What utilities and environment are required?
Contact PCBSEP
Send your PCB panel data—get a fast recommendation or sample-cut plan. Email: [email protected]. We review your data, propose the cut recipe and cycle-time estimate, and (if requested) arrange a sample cut.
Related Products
DirectLaser H1 — High-Precision, 300 × 350 mm
Micron-class repeatability for compact, high-accuracy work. Best when you need tight keep-outs and clean edges with minimal HAZ.
DirectLaser S2 — Offline, Single-Platform
Entry-level UV depaneler for low/medium takt SMT. Compact footprint, stable steel frame, cost-effective for standard FR-4/FPC jobs.
DirectLaser H3 — Dual-Platform, Offline
Two shuttle tables cut while you load the next panel—significant throughput gain vs. single-platform. Suited to standard SMT depaneling.
DirectLaser S4 — Inline PCBA Laser Depaneling
Drops straight into SMT lines; supports barcode/traceability and MES. Fits any PCBA outline; ideal when you want no manual load/unload.
DirectLaser H5 — Large-Platform, Bridge-Gantry
High-stability X/Y split-axis for thick copper, rigid-flex, and complex outlines. Ships offline; can be upgraded to inline (three-section conveyor).
Sample Cutting & Process Report
Send your CAD and panel details; we provide cut samples, photos, optional edge micrographs, recommended laser parameters, and a cycle-time/yield estimate so you can decide fast.
Remote Video Support
Live, encrypted video sessions for setup, recipe tuning, vision alignment, and basic maintenance. Quick scheduling, clear checklists, and follow-up notes to keep your line running.
On-Site Commissioning & Training
Certified engineers handle installation, calibration, and operator training—handing over SOPs and acceptance results to your quality standard. Available across our service regions.