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China's leading manufacturer of PCB Laser Dapaneling Machine
One-Stop PCB Depaneling Solutions
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Building 2, Songhu Zhigu Research Center, Dongguan City, Guangdong Province, China
DirectLaser H5 — Large-Platform PCB/FPC Laser Depaneler
Bridge-gantry architecture with X/Y split motion on a granite base and linear motors. Designed for large or complex panels with micron-level stability and clean, stress-free cuts.
Max working area: 520 × 520 mm (up to 580 × 580 mm supported)
Platform: Granite table, linear motors
Resolution (X/Y/Z): 1 μm
Repeatability: ≤ ±2 μm
Options: Camera target alignment, industrial dust extraction
Platform: Granite table, linear motors
Resolution (X/Y/Z): 1 μm
Repeatability: ≤ ±2 μm
Options: Camera target alignment, industrial dust extraction
Built for Big Panels, Built for Accuracy
H5’s bridge-gantry and granite base deliver stable micron-class motion on a 520 × 520 mm field. Choose UV/Green, ns/ps lasers to match materials and edge quality.
What DirectLaser H5 DeliversLarge field, precise control, clean edges—ready for demanding SMT work.
Large process area — 520 × 520 mm (max 580 × 580 mm) for big or multi-up panels.
Bridge-gantry, X/Y split motion — cutting head travels on X; table moves on Y for stability.
Granite + linear motors — rigid structure and smooth dynamics for repeatable accuracy.
Micron-level control — 1 μm resolution; ≤ ±2 μm repeatability.
Flexible laser choices — UV/Green; picosecond or nanosecond to balance HAZ vs. speed.
Clean processing — optional industrial dust extraction; enclosure-ready integration.
Vision alignment (optional) — camera-based target system for precise registration.
Standard workflow — CircuitCAM 7.5 (data prep) + DreamCreaTor 3 (machine control).
Large process area — 520 × 520 mm (max 580 × 580 mm) for big or multi-up panels.
Bridge-gantry, X/Y split motion — cutting head travels on X; table moves on Y for stability.
Granite + linear motors — rigid structure and smooth dynamics for repeatable accuracy.
Micron-level control — 1 μm resolution; ≤ ±2 μm repeatability.
Flexible laser choices — UV/Green; picosecond or nanosecond to balance HAZ vs. speed.
Clean processing — optional industrial dust extraction; enclosure-ready integration.
Vision alignment (optional) — camera-based target system for precise registration.
Standard workflow — CircuitCAM 7.5 (data prep) + DreamCreaTor 3 (machine control).
DirectLaser H5 DataTable
| Item | DirectLaser H5 |
| Laser output power | 20 W (options: 15 W, 25 W, 35 W, 60 W) |
| Pulse type | Nanosecond / Picosecond (optional) |
| Laser wavelength | 355 nm / 532 nm |
| Max processing area | 520 mm × 520 mm (max supported 580 × 580 mm) |
| Platform | Granite table, linear motors |
| X/Y/Z resolution | 1 μm |
| Repeatability | ≤ ±2 μm |
| Data processing software | CircuitCAM 7.5 Standard |
| Control software | DreamCreaTor 3 |
| Camera target alignment | Optional |
| Industrial dust extraction | Optional |
| Dimensions (W × H × D) | 1,250 mm × 1,560 mm × 1,760 mm |
| Weight | 1,500 kg |
| Power | 380 VAC / 50 Hz, 3.5 kW |
| Ambient temperature | 22 °C ±2 °C |
Typical Results on Large/Complex Boards
Clean, narrow-kerf outcomes with minimal thermal impact. PCBA depaneling — stress-free separation close to components. FPC/rigid-flex profile cutting — burr-free outlines and tight radii. Coverlay window cutting — accurate, consistent openings on FPC coverlay. Large panel / multi-up jobs
PCBA Depaneling
Gold-Finger Cutting
FPC Profile Cutting
Coverlay Cutting
Optional Nanosecond UV Laser — IntroA 355 nm nanosecond UV laser optimized for PCB/FPC depaneling. High beam quality and stable energy delivery enable narrow kerf, low HAZ, and consistent edge finish on FR-4, FPC/PI, LCP and similar stacks. Power options cover diverse takt needs (≥20 W shown; 15/25/35/60 W available).
Nanosecond UV Laser Specs
| Specification | 15–60 W Nanosecond UV Laser |
| Power options (UV) | ≥20 W model shown; 15/25/35/60 W available |
| Wavelength (nm) | 355 |
| Average power (W) | >20 @ 50 kHz |
| Pulse energy (µJ) | >300 |
| Repetition rate (kHz) | 40–300 |
| Pulse width (ns) | <15 |
| Beam circularity (%) | >90 |
| Beam diameter at window (mm) | ≈0.55 |
| Beam quality M² | <1.2 |
| Beam divergence (mrad) | <2 |
| Energy stability (% RMS) | <3 |
| Pointing stability (µrad/°C) | <20 |
| Polarization ratio | >100:1 |
DirectLaser H5 — Frequently Asked Questions
Straight answers about capacity, accuracy, and options.
What is the max working area?
How accurate is it?
Which lasers can I choose?
What makes it stable on large panels?
What utilities and environment are required?
Which jobs benefit most from H5?
Get a Large-Panel Cut Recommendation
Email your panel drawing or photo with material & thickness, board size, panel layout, target takt, and CAD files (Gerber/ODB++/DXF/Excellon). We’ll return a tuned recipe and cycle-time estimate.
Related Products
DirectLaser H1 — High-Precision, 300 × 350 mm
Micron-class repeatability for compact, high-accuracy work. Best when you need tight keep-outs and clean edges with minimal HAZ.
DirectLaser S2 — Offline, Single-Platform
Entry-level UV depaneler for low/medium takt SMT. Compact footprint, stable steel frame, cost-effective for standard FR-4/FPC jobs.
DirectLaser H3 — Dual-Platform, Offline
Two shuttle tables cut while you load the next panel—significant throughput gain vs. single-platform. Suited to standard SMT depaneling.
DirectLaser H3 330D — Dual-Platform, 350 × 520 mm
High-volume depaneling for large or multi-up panels. Faster cycle time from overlapping load/unload; optional inline upgrade pathway.
DirectLaser S4 — Inline PCBA Laser Depaneling
Drops straight into SMT lines; supports barcode/traceability and MES. Fits any PCBA outline; ideal when you want no manual load/unload.
Sample Cutting & Process Report
Send your CAD and panel details; we provide cut samples, photos, optional edge micrographs, recommended laser parameters, and a cycle-time/yield estimate so you can decide fast.
Remote Video Support
Live, encrypted video sessions for setup, recipe tuning, vision alignment, and basic maintenance. Quick scheduling, clear checklists, and follow-up notes to keep your line running.
On-Site Commissioning & Training
Certified engineers handle installation, calibration, and operator training—handing over SOPs and acceptance results to your quality standard. Available across our service regions.