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China's leading manufacturer of PCB Laser Dapaneling Machine
One-Stop PCB Depaneling Solutions
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Building 2, Songhu Zhigu Research Center, Dongguan City, Guangdong Province, China
DirectLaser S2 — PCB/FPC Laser Cutting Machine
An offline, single-platform UV/Green laser depaneling system for small/medium PCBs and FPCs. Built on a granite table for stability, with CCD vision and a practical contour library for everyday SMT separation.
Working area: 350 × 350 mm
Platform: Granite single table (offline)
Materials: FR-4, FPC/PI, LCP (and similar polymer stacks)
Platform: Granite single table (offline)
Materials: FR-4, FPC/PI, LCP (and similar polymer stacks)
Clean, stress-free depaneling for compact boards.
DirectLaser S2 targets standard offline SMT PCB separation. It minimizes thermal impact, avoids mechanical stress near components, and keeps the work area clean with real-time fume extraction.
Features
High-precision cutting – Suitable for small formats and complex PCB/FPC outlines.
Minimal stress – Non-contact laser path protects components placed close to the cut.
Clean processing – Real-time exhaust removes gas and debris for consistent edges.
Offline SMT ready – Drops into existing flows without line changes.
Vision alignment – CCD automatic target capture; supports irregular targets. If no fiducials are available, DIL modules can be used.
Contour library & smoothing – Straight, L, U, circle, arc; path “tweening to straight line.”
High-precision cutting – Suitable for small formats and complex PCB/FPC outlines.
Minimal stress – Non-contact laser path protects components placed close to the cut.
Clean processing – Real-time exhaust removes gas and debris for consistent edges.
Offline SMT ready – Drops into existing flows without line changes.
Vision alignment – CCD automatic target capture; supports irregular targets. If no fiducials are available, DIL modules can be used.
Contour library & smoothing – Straight, L, U, circle, arc; path “tweening to straight line.”
Process Advantages With Laser Cutting Application Results
FPC Profile Cutting — Burr-free outlines, tight radii; narrow kerf improves panel utilization.
PCBA Depaneling — Clean separation close to components and copper; stress-free edges.
Coverlay Cutting — Accurate window openings and perimeter trims on FPC coverlay; no delamination.
Gold-Finger Trimming — Precise finishing around connector pads; plating quality protected.
FPC Profile Cutting — Burr-free outlines, tight radii; narrow kerf improves panel utilization.
PCBA Depaneling — Clean separation close to components and copper; stress-free edges.
Coverlay Cutting — Accurate window openings and perimeter trims on FPC coverlay; no delamination.
Gold-Finger Trimming — Precise finishing around connector pads; plating quality protected.
DirectLaser S2 DataTable
| Parameter | DirectLaser S2 |
| Laser Type | Green or UV; picosecond or nanosecond options |
| Laser Wavelength | 355 nm / 532 nm |
| System Accuracy | ±25 µm |
| Repeatability | ±2 µm |
| Processing Head | Galvo scanner, Scanlab |
| Vision Alignment | CCD, 1.6 MP (standard) |
| Max Processing Area | 350 × 350 mm |
| Platform Height | 900 ± 50 mm |
| Machine Platform | Granite base, linear motors |
| Safety | Safety light curtain; automatic doors |
| Data Preparation Software | CircuitCAM 7 Standard |
| Machine Control Software | DreamCreaTor 3 |
| Machine Dimensions (H×W×D) | 1624 mm × 917 mm × 1207 mm |
| Machine Weight | 700 kg |
| Power Supply | 380 VAC / 50 Hz, 4.5 kW |
DirectLaser S2 Offline PCB/FPC Laser Depaneling Image Gallery
Applicable materials: PCBA, FPC, LCP, MPI, PI, FR-4/polyimide, HTCC/LTCC ceramics, and other encapsulation materials.
MPI-PCB
Copper-PCB
Flexible-circuit-boards-for-polyimide
FR4-PCB
Frequently Asked Questions
Quick technical answers about process, quality, and integration.
What is the max working area?
How accurate is it?
Is S2 inline or offline?
Which materials are supported?
Which wavelengths are available?
What file formats are supported?
How does vision alignment work?
What are the utilities?
Which OS and software?
Contact PCBSEP
Send your PCB panel data—get a fast recommendation or sample-cut plan. Email: [email protected]. We review your data, propose the cut recipe and cycle-time estimate, and (if requested) arrange a sample cut.
Related Products
DirectLaser H1 — High-Precision, 300 × 350 mm
Micron-class repeatability for compact, high-accuracy work. Best when you need tight keep-outs and clean edges with minimal HAZ.
DirectLaser H3 — Dual-Platform, Offline
Two shuttle tables cut while you load the next panel—significant throughput gain vs. single-platform. Suited to standard SMT depaneling.
DirectLaser H3 330D — Dual-Platform, 350 × 520 mm
High-volume depaneling for large or multi-up panels. Faster cycle time from overlapping load/unload; optional inline upgrade pathway.
DirectLaser S4 — Inline PCBA Laser Depaneling
Drops straight into SMT lines; supports barcode/traceability and MES. Fits any PCBA outline; ideal when you want no manual load/unload.
DirectLaser H5 — Large-Platform, Bridge-Gantry
High-stability X/Y split-axis for thick copper, rigid-flex, and complex outlines. Ships offline; can be upgraded to inline (three-section conveyor).
Sample Cutting & Process Report
Send your CAD and panel details; we provide cut samples, photos, optional edge micrographs, recommended laser parameters, and a cycle-time/yield estimate so you can decide fast.
Remote Video Support
Live, encrypted video sessions for setup, recipe tuning, vision alignment, and basic maintenance. Quick scheduling, clear checklists, and follow-up notes to keep your line running.
On-Site Commissioning & Training
Certified engineers handle installation, calibration, and operator training—handing over SOPs and acceptance results to your quality standard. Available across our service regions.