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China's leading manufacturer of PCB Laser Dapaneling Machine

One-Stop PCB Depaneling Solutions

PCB Laser Depaneling Machines – Offline & Inline Lineup

Six systems for laser depaneling PCB across FR-4, FPC/rigid-flex, ceramics, and IMS. Clean, stress-free laser cut PCB with micron-class accuracy—fit for R&D to high-volume SMT, MES-ready.

Efficient Cutting with PCBSEP Depaneling Machines

Laser depaneling is the clean, stress-free way to separate PCBs. PCBSEP systems combine UV/Green sources, precision motion, and vision alignment to deliver narrow-kerf, low-HAZ cuts on FR-4, Flexible Circuits, Ceramic PCBs, and IMS—from offline to inline, small to large panels.

PCBSEP Depaneling Portfolio — Overview

Model Working Area (X×Y) Cutting Precision Repeat Precision Architecture / Mode Typical Use Materials
DirectLaser H1 350×350 mm ±25 µm ±2 µm Single-platform / Offline Compact, tight keep-outs on FR-4 & FPC FR-4, FPC/PI, Ceramics, IMS
DirectLaser S2 350×350 mm ±20 µm ±2 µm Granite table / Offline Daily SMT depaneling for FR-4/FPC FR-4, FPC/PI, LCP
DirectLaser S4 350×350 mm ±20 µm ±3 µm Track-inline (3-step) Inline PCBA depaneling with full traceability FR-4, FPC/PI, LCP
DirectLaser H3 300×300 mm Dual-platform / Inline Continuous cutting, high UPH inline FR-4, FPC/PI, LCP
DirectLaser H3 330D 350×520 mm ±20 µm ±2 µm Dual-platform / Offline (inline upgrade opt.) Post-placement depaneling, coverlay windows, large/multi-up panels FR-4, FPC/PI, LCP
DirectLaser H5 520×520 mm (max 580×580) ≤±2 µm Bridge-gantry, granite + linear motors (Offline) Large/complex boards, rigid-flex, IMS FR-4, FPC/PI, Ceramics, IMS
DirectLaser H1 — High-Precision UVPs PCB Laser Cutter

DirectLaser H1 — Compact Precision (350 × 350 mm)

Compact, single-platform UV depaneler for tight keep-outs and clean, low-HAZ edges.
Use: Tight keep-outs, small/medium FR-4 & FPC.
Highlights: Single platform; ±25 μm cutting, ±2 μm repeat; UV (ns); vision alignment.

PCBSEP DirectLaser S2

Offline “workhorse” on a granite table for daily SMT separation with stable precision.
Use: Daily SMT depaneling on FR-4/FPC.
Highlights: Granite table; ±20 μm cutting, ±2 μm repeat; UV/Green; CCD target capture.
DirectLaser S2 — PCBFPC Laser Cutting Machine
DirectLaser-S4

PCBSEP DirectLaser S4

Track-inline PCBA depaneler; compact, enclosed, and easy to drop into SMT lines.
Use: Inline depaneling with minimal handling and full traceability.
Highlights: Working area 350×350 mm · Cut ±20 µm · Repeat ±3 µm · 3-step inline transfer · MES/Barcode options

PCBSEP DirectLaser H3

Inline dual-platform system that keeps the laser cutting while you load the next panel.
Use: Continuous inline throughput where UPH matters.
Highlights: Working area 300×300 mm (dual tables) · UV/Green/IR (ns/ps) · Vision capture · Servo + GTS-400 · intelliSCAN + RTC5
DirectLaser H3 — Inline Dual-Platform PCB Laser Depaneler
DirectLaser H3 330D — Dual-Platform Laser Depaneling Machine

DirectLaser H3 330D

Dual-platform with a large 350×520 mm field for multi-up or oversized panels.
Use: Post-placement PCBA depaneling, FPC coverlay windows, and big panel jobs.
Highlights: Cut ±20 µm · Repeat ±2 µm · UV/Green options · Camera pre-positioning (opt.) · Inline upgrade option

DirectLaser H5

Large-platform bridge-gantry with granite + linear motors for micron-class stability.
Use: Large/complex boards, rigid-flex, IMS, and thick-copper designs.
Highlights: 520×520 mm (up to 580×580 mm support) · 1 µm resolution · Repeat ≤±2 µm · UV/Green (ns/ps)
DirectLaser-H5

Software (Included)

Every machine ships with DreamCreaTor (machine control) and CircuitCAM (data prep).

Options include barcode/QR, recipe control, traceability/MES integration, bad-board handling, and supervisor statistics—mirroring the “software + options” block in the reference layout.
Process-advantages-with-laser-Simple-operation
Factory-workshop-display

Service Packages

Global install, calibration, operator training, process optimization, and tiered support to match your uptime needs—structured like the “service packages” section on the reference page.
Essential: Install + basic training
Plus: Preventive maintenance + remote response
Premium: Priority parts + on-site SLA, advanced process tuning

Contact & Requests

Two quick paths—like the “Request a sample / Request a quote” actions on the reference page.
Request a Sample: Send CAD and panel details; get cut photos/micrographs, parameters, and cycle-time estimate.
Request a Quote: Share model(s) of interest, annual/monthly volume, and automation/MES needs.
Drag & Drop Files, Choose Files to Upload You can upload up to 5 files.
Accepted: (.png, .gif, .jpg, .doc, .xls, .ppt, .pdf, .zip, .rar) Not Accepted: (.exe, .bat, .cmd, .js, .vbs, .ps1) If you need to upload specialized file extensions, such as CAD, please contact us directly.
What You Need?
We will usually reply you within 30 minutes (working days).

Sample Cutting & Process Report

Send your CAD and panel details; we provide cut samples, photos, optional edge micrographs, recommended laser parameters, and a cycle-time/yield estimate so you can decide fast.

Remote Video Support

Live, encrypted video sessions for setup, recipe tuning, vision alignment, and basic maintenance. Quick scheduling, clear checklists, and follow-up notes to keep your line running.

On-Site Commissioning & Training

Certified engineers handle installation, calibration, and operator training—handing over SOPs and acceptance results to your quality standard. Available across our service regions.