FAQ — Professional PCB Laser Depaneling Machine Solution
Straight answers about capability, accuracy, integration, data, and service for PCB laser depaneling.
What cutting accuracy can I expect?
Typical ±20–25 µm cutting accuracy with ±2–3 µm repeatability (model-dependent).
How narrow is the kerf?
Tens of microns; narrow kerf boosts panel utilization vs. routing or punching.
What are the working areas of each model?
H1: 300×350 mm · S2: 350×350 mm · S4 (inline): 350×350 mm · H3 (inline, dual-platform): 300×300 mm · H3 330D (dual-platform): 350×520 mm · H5: 520×520 mm (up to 580×580 mm supported).
How fast is laser vs. routing?
Comparable or faster on complex contours; no bit changes and fewer handling steps raise UPH.
If you want, I can add a short contact strip at the end: “Send your drawing/photo to [email protected] for a fast recommendation or sample-cut plan.”
Sample Cutting & Process Report
Send your CAD and panel details; we provide cut samples, photos, optional edge micrographs, recommended laser parameters, and a cycle-time/yield estimate so you can decide fast.
Remote Video Support
Live, encrypted video sessions for setup, recipe tuning, vision alignment, and basic maintenance. Quick scheduling, clear checklists, and follow-up notes to keep your line running.
On-Site Commissioning & Training
Certified engineers handle installation, calibration, and operator training—handing over SOPs and acceptance results to your quality standard. Available across our service regions.